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 EE-SX1107/1108/1109/1131
Ultra-Compact Photomicrosensors with Surface-Mount Design
Surface mount design, and tape and reel packaging facilitate automated PCB assembly s Compact size makes these sensors ideal for use in applications with restricted space s High-resolution sensing with phototransistor output
s s
Dual channel model that is ideal for encoder applications (EE-SX1131)
Ordering Information
Appearance Sensing method Transmissive Slot width 1 mm Slot depth 2 mm Sensing object Opaque 0.15 x 0.6 mm min. Weight 0.05 g Part number EE-SX1107
2 mm
2.8 mm
Opaque 0.3 x 1.0 mm min.
0.1 g
EE-SX1108
3 mm
3.5 mm
Opaque 0.5 x 1.0 mm min.
0.1 g
EE-SX1109
Dual channel transmissive
2 mm
2.8 mm
Opaque 0.3 x 1.0 mm min.
0.1 g
EE-SX1131
EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
Specifications
s ABSOLUTE MAXIMUM RATING (TA=25C)
Item Emitter Forward current Pulse forward current Reverse voltage Detector Collector-emitter voltage Emitter-collector voltage Collector current Collector dissipation Ambient temperature Operating Storage Soldering (manual) Soldering (reflow) Symbol IF IFP VR VCEO VECO IC PC Topr Tstg Tsol Tsol Rated value 25 mA (see note) 100 mA (duty: 1/100, pulse width: 0.1 ms) 5V 20 V 5V 20 mA 75 mW (see note) -30 to 85C -40 to 90C 300C (3 second max.) 240C (10 second max)
Note: Refer to Engineering Data if the ambient temperature is not within the normal room temperature range.
s CHARACTERISTICS (TA=25C)
Item Emitter Forward voltage Reverse current Peak emission wavelength Detector Dark current Peak spectral sensitivity wavelength Combination Light current (collector-current) Collector-emitter saturation voltage Rising time Falling time Symbol VF IR P(L) ID P(P) IL VCE (sat) tr tf Value 1.1 V typ., 1.3 V max. 10 A max. 940 nm typ. 100 nA max. 900 nm typ. 50 A min., 150 A typ., 500 A max. 0.1 V typ., 0.4 V max. 10 s typ. (see note) 10 s typ. (see note) Condition IF = 5 mA VR = 5 V IF = 20 mA VCE = 10 V, 0 lx -- IF = 5 mA, VCE = 5 V IF = 20 mA, IL = 50 A VCC = 5 V, RL = 1K IL = 100 A
Note: The following figures show the rising time (tr) and falling time (tf).
Input t 90%
Input
IL
VCC
Output Output 10% tr tf t RL
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EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
Engineering Data
Note: The operating conditions of the photomicrosensor must be within the absolute maximum rating ranges.
s TEMPERATURE CHARACTERISTICS
140 50
s INPUT CHARACTERISTICS (TYPICAL)
50
Collector dissipation PC (mW)
Forward current IF (mA)
Forward current IF (mA)
120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100
40 30 20 10 0 -40
40 Ta=25C 30 20 10 0 1.0
-20
0
20
40
60
80
100
1.1
1.2
1.3
1.4
1.5
1.6
Ambient temperature Ta (C)
Ambient temperature Ta (C)
Forward voltage VF (V)
s INPUT/OUTPUT CHARACTERISTICS (TYPICAL)
EE-SX1107
910
EE-SX1108/1131
910
EE-SX1109
910
Light current IL (A)
Light current IL (A)
710 610 510 410 310 210 110 10 0 10 20 30 Ta=25C VCE=5 V 40 50
Light current IL (A)
810
810 710 610 510 410 310 210 110 10 0 10 20 30 VCE=5 V 40 50 Ta=25C
810 710 610 510 410 310 210 110 10 0 10 20 30 Ta=25C VCE=5 V 40 50
Forward current I F (mA)
Forward current I F (mA)
Forward current IF (mA)
s OUTPUT CHARACTERISTICS (TYPICAL)
EE-SX1107
700 600 Ta=25C
EE-SX1108/1131
700 600 Ta=25C
EE-SX1109
700 600 Ta=25C
Light current IL (A)
Light current IL (A)
500 400 300 200 100 0 0 2 4 6 8 10 12 14 5 mA 10 mA
500 400 300
Light current IL (A)
10 mA
500 400 10 mA 300 200 100 5 mA
5 mA 200 100 0 0 2 4 6 8 10 12 14
0
0
2
4
6
8
10
12
14
Collector-emitter voltage VCE (V)
Collector-emitter voltage VCE (V)
Collector-emitter voltage VCE (V)
s LIGHT CURRENT TEMPERATURE DEPENDENCY (TYPICAL)
160 140
s DARK CURRENT TEMPERATURE DEPENDENCY(TYPICAL)
1000 VCE=10 V
s RESPONSE TIME CHARACTERISTICS (TYPICAL)
1000
Llight current IL (%)
120 100 80 60 40 20 0 -40 -20 0 20 40 IF=5 mA VCE=5 V 60 80 100
100
Response time tr, tf (s)
Dark current ID (nA)
100
Input 0 Output 0 tr Input 90% 10% IL RL tf VCC Output t t
10
10
1 V CE=2 V 0.1 -40 -20 0 20 40 60 80 100
1
1
10 Load resistance RL (K)
100
Ambient temperature Ta (C)
Ambient temperature Ta (C)
3
EE-SX1107/1108/1109/1131
s SENSING POSITION CHARACTERISTICS (TYPICAL)
EE-SX1107
120 120
EE-SX1107/1108/1109/1131
EE-SX1108/1109/1131
120
Relative light current IL (%)
Relative light current IL (%)
100 80 60 40 20 0 -1.2 VCE=5 V IF=5 mA -0.6 0 Distance: d (mm) 0.6 1.2 d
100 80 60 40 20 0 -0.6 VCE=5 V IF=5 mA -0.4 -0.2 0 0.2
Relative light current IL (%)
d
100 80 60 40 20 0 -1.2 VCE=5 V IF=5 mA d
0.4
0.6
-0.6
0 Distance: d (mm)
0.6
1.2
Distance: d (mm)
s SENSING POSITION CHARACTERISTICS (TYPICAL)
EE-SX1108
120
EE-SX1109
120
EE-SX1131
120
Relative light current IL (%)
Relative light current IL (%)
100 80 60 40 20 0 -0.6 VCE=5 V IF=5 mA
d
100 80 60 40 20 0 -0.6 IF=5 mA V CE=5 V -0.4 -0.2 0 0.2
Relative light current IL (%)
d
100 80 60 40 20 0 -0.6 IF=5 mA V CE=5 V -0.4 -0.2 0 0.2 0.4 0.6 d
-0.4
-0.2
0
0.2
0.4
0.6
0.4
0.6
Distance: d (mm)
Distance: d (mm)
Distance: d (mm)
Dimensions
Unit: mm (inch)
s EE-SX1107
A C 3.0 (0.12) White stripe K E
3.4 (0.13) A 0.150.05 (0.01) [0.5 (0.02)] 1.0 (0.04) Optical axis R 0.3 (0.01)
1.0+0.2 (0.04) 0 1.2 (0.05)
3.0 (0.12) 2.0 (0.08)
0.6 (0.02)
1.0 (0.04) [0.5 (0.02)] A (Cross section AA view) [0.5 (0.02)] 1.6 (0.06) 1.2 (0.05)
Note: 1. Unless otherwise specified, tolerances are 0.15 mm. 2. The values in brackets are relative dimensions.
4
EE-SX1107/1108/1109/1131
Recommended soldering pattern Pin assignment
A C
EE-SX1107/1108/1109/1131
1.2 (0.05)
K E
0.4 (0.02) 1.2 (0.05)
A K C E
Anode Cathode Collector Emitter
1.8 (0.07)
1.8 (0.07)
1.8 (0.07)
s EE-SX1108
A C 4.0 (0.16) K E
White stripe
5.0 (0.20)
0.30.05 (0.01) A 1.0 (0.04) 1.0 (0.04) Optical axis
2.0+0.2 0 (0.08)
[1.0 (0.04)] 1.5 (0.06)
4.0 (0.16) 2.8 (0.11) E C
R 0.3 (0.01)
1.0 (0.04) [0.5 (0.02)] (Cross section AA view) A [0.5 (0.02)] 2.2 (0.09) 1.6 (0.06)
Recommended soldering pattern
1.6 (0.06)
Pin assignment
A C
K
E
0.6 (0.02)
A
Anode Cathode Collector Emitter
1.6 (0.06)
K C E
2.0 (0.08)
3.0 (0.12)
2.0 (0.08)
Note: 1. Unless otherwise specified, tolerances are 0.15 mm. 2. The values in brackets are relative dimensions.
5
EE-SX1107/1108/1109/1131
Unit: mm (inch)
EE-SX1107/1108/1109/1131
s EE-SX1109
A
C
White stripe K E
4.0 (0.16)
6.0 (0.24)
3.0+0.2 (0.12) 0 0.50.05 (0.02) A 1.0 (0.04) 1.0 (0.04) Optical axis 5.0 (0.20) R 0.3 (0.01) [1.5 (0.06)] 1.5 (0.06)
3.5 (0.14)
1.0 (0.04) [0.5 (0.02)] (Cross section AA view) A [0.5 (0.02)] 1.6 (0.06) 2.2 (0.09)
Recommended soldering pattern
1.6 (0.06)
Pin assignment
A C
0.6 (0.02) 1.6 (0.06)
K
E
A K C E
Anode Cathode Collector Emitter
2.0 (0.08)
4.0 (0.16)
2.0 (0.08)
Note: 1. Unless otherwise specified, tolerances are 0.15 mm. 2. The values in brackets are relative dimensions.
6
EE-SX1107/1108/1109/1131
s EE-SX1131
EE-SX1107/1108/1109/1131
A
C 4.0 (0.16)
NC
E1
White stripe
K
E2
6.0 (0.24)
0.80.05 (0.03) 0.30.05 (0.01)
[1.0 (0.04)] A 1.0 (0.04)
2.0+0.2 0 (0.08)
1.5 (0.06)
1.0 (0.04)
Optical axis
4.0 (0.16) 2.8 (0.11) R 0.3 (0.01)
1.0 (0.04) A (Cross section AA view) [0.5 (0.02)] [0.5 (0.02)] 1.4 (0.06) 1.0 (0.04) 1.4 (0.06)
Recommended soldering pattern
0.4 (0.02)
Pin assignment
C A
1.0 (0.04)
NC
E1
1.0 (0.04)
K
E2
A
Anode No connection Cathode Collector Emitter 1 Emitter 2
1.0 (0.04) 0.4 (0.02) 2.0 (0.08) 3.0 (0.12) 2.0 (0.08)
NC K C E1 E2
Note: 1. Unless otherwise specified, tolerances are 0.15 mm. 2. The values in brackets are relative dimensions.
7
EE-SX1107/1108/1109/1131
Unit: mm (inch)
EE-SX1107/1108/1109/1131
s TAPE AND REEL
Reel
dia. 21.00.8 (0.83) 2.00.5 (0.08) dia. 13.00.5 (0.51) dia. 80.01.0 (3.50)
dia. 330.02.0 (13.00)
Label
12.4+0.2 (0.49) 0 18.4 max. (0.73)
Tape
Figure 1
m 4.0 (0.16) dia. 1.5 (0.06) 1.75 (0.07) Part number 5.5 (0.22) n C A 12.0 (0.47) EE-SX1107 EE-SX1108 EE-SX1131 h 3.2 (0.13) 4.2 (0.17) 4.2 (0.17) l 3.6 (0.14) 5.2 (0.20) 5.2 (0.20) m 0.9 (0.04) 0.25 (0.01) 0.25 (0.01) n 3.2 (0.13) 4.2 (0.17) 4.2 (0.17)
E
K
0.3 (0.01) l h 8.0 (0.32)
Figure 2
4.0 (0.16) m
dia. 1.5 (0.06)
1.75 (0.07) Part number EE-SX1109 12.0 (0.47) h 5.2 (0.20) l 6.2 (0.24) m 0.25 (0.01) n 4.2 (0.17)
C E
K n A
5.5 (0.22)
0.3 (0.01) l h 12.0 (0.47)
Tape configuration
more than 40 mm (1.58) Empty Parts mounted more than 400 mm (15.76) Leading part
Empty more than 40 mm (1.58)
Quantity per reel
Part number EE-SX1107 EE-SX1108/EE-SX1131 EE-SX1109 Pieces per reel 2500 2000 1000
8
EE-SX1107/1108/1109/1131
EE-SX1107/1108/1109/1131
Precautions
s SOLDERING INFORMATION
Reflow soldering
* Reflow soldering must be done within 48 hours after opening the aluminum envelope. The component must be stored under 30C at 80% RH. * The following soldering paste is recommended: Melting temperature: 178~192C Composition: Sn 63%, Pb 37% * Recommended thickness of metal mask is between 0.2 mm and 0.25 mm for screen printing. * The following chart illustrates the maximum temperature limits for soldering:
250 10 sec. max.
230C max.
Temperature (C)
200 4C/sec. max. 150 4C/sec. max. 60~120 sec. 100 140~160C 40 sec. max.
Time
Manual soldering
* "Sn 60" (60% tin and 40% lead) or solder with silver content is recommended. * Use a soldering iron of less than 25W. The temperature of the iron tip must be kept above 300C (572F). * Solder each land for a maximum of 3 seconds.
OMRON ELECTRONICS LLC
One East Commerce Drive Schaumburg, IL 60173
OMRON CANADA, INC.
885 Milner Avenue Scarborough, Ontario M1B 5V8
1-800-55-OMRON
Cat. No. E02DAD2 3/01 Specifications subject to change without notice.
416-286-6465
Printed in the U.S.A.
9


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